Today’s advanced electronic assemblies feature smaller tracks, embedded components, and ultra-fine geometries, making them highly sensitive to particle contamination, electrostatic discharge (ESD), and mechanical strain. This presentation will explore why leading manufacturers integrate board cleaning at the very start of the SMT line as part of a Zero Defect Strategy. With over 60% of defects occurring at the solder print stage, ensuring a pristine surface before key processes—such as solder paste application —is essential to preventing failures.