Comparative analyses show that mechanical routing approaches their limits in precision, stress impact, and technical cleanliness, while laser depaneling provides superior edge quality, reduced particle generation, and material‑agnostic processing performance. Given that FR4 remains dominant but the material mix diversifies, hybrid systems integrating laser, milling, and sawing enable application‑specific process optimization, higher reproducibility, and reduced mechanical load. This paper outlines key process trade‑offs and demonstrates how combined laser–milling architectures provide a scalable, future‑proof solution for high‑mix, high‑quality electronics manufacturing.