Advancing miniaturization, rising power densities, and the shift toward ceramics, IMS, and flexible substrates significantly challenge traditional depaneling processes.
Advancing miniaturization, rising power densities, and the shift toward ceramics, IMS, and flexible substrates significantly challenge traditional depaneling processes.
National Electronics Society of Hungary
H–1044 Budapest, Ipari Park utca 10.
Zsolt Heiling Event Manager
Email: heiling [at] melt.hu