Program

Opening Ceremony Tuesday (Stage A)
09.25
Briefing of the president of the National Electronics Society of Hungary
09.30 InnoElectro Grand Prize ceremony
Design Tuesday (Stage A)
10.00
You can keep up with the accelerating technological evolution!
10.30
IoT 2025: Connected Intelligence – Opportunities, Challanges, and What's Behind It
11.00
Efficiency in wiring
11.15
Safe connections for energy storage systems
Artificial Intelligence in Design – Panel discussion Tuesday (Stage A)
11.30
Will engineers be needed in the future? – AI-based technologies in PCB design
Efficiency, reliability, quality control in manufacturing Tuesday (Stage A)
13.00
How can you revolutionize PCB traceability?
13.30
Which is better? Sealed or Open X-Ray source: Performance, Maintenance and Application fields
14.00
Technical cleanliness – where are we heading in 2025?
14.30
The periodic table in our pocket - the building blocks of electronic products
15.00
PCB strain measurement in focus – innovative wireless technology as extra
Engineering Education Tuesday (Stage A)
15.30
BME Vision and Operation Model
15.45
The Future of Engineering Education in Hungary – Panel Discussion
Innovation in manufacturing I. Tuesday (Stage B)
10.00
Contactless Dispensing – An Alternative for Solder and Sinter Paste Application
10.30
Electrification & Power Modules – Innovative High Reliability Solder Materials
11.00
Actnano coatings for protecting high reliability electronics
11.30
Everybody does it differently, or a few words about thermocouple attachment methods!
12.00
Cleaning before coating - the latest insights
Innovation in manufacturing II. Tuesday (Stage B)
13.30
Resilience and possibilities in the electronic manufacturing – Panasonic’s Autonomous Factory
14.00
Solder Inspection Outside to Inside
14.30
The impact of advanced ultrasonic welding on battery integrity and efficiency scaling up battery production
15.00
Importance of Vibration and Temperature Monitoring
15.30
Latest Electronics Production – Fully Connected
Industry trends Wednesday (Stage A)
10.00
Quantifying Change: Navigating the 2025 Automotive Industry Bottom and the Road Ahead in Europe
10.30
What Could Disrupt the Current Stability of the Semiconductor Market?
11.00
Top Electronics and Innovation Marketplaces in Hong Kong
CyberSecurity Wednesday (Stage A)
11.30
Is Your Product Cyber Resilient?
12.00
The Impact of Cyber Resilience Act on Products Containing Digital Element
Innovation in manufacturing III. Wednesday (Stage A)
13.30
Sustainable reflow technology: Optimization for the SMD production
14.00
The application of vacuum technology in the reflow soldering process.
14.30
LX-8 The Brand New, Flexible High Speed Placement Platform
EMS panel discussion Wednesday
15.00
EMS companies in a changing economic environment
Advanced Electronics Assembly Conference (organized by SMTA) Wednesday (Stage B)
10.00
Strategies for Cost Optimized Realization of Technical Cleanliness Requirements in Electronics Manufacturing
11.00
Why Clean Bare Boards? Exploring Contact Cleaning for Effective Contamination Control at the Start of the SMT Line
12.00
Thermally Conductive Granulates as Advanced Materials for Electronic Protection
14.00
Advanced Conformal Coating Processes
15.00
Beyond FR4: Exploring Advanced and Organic Materials in PCB Design
Space and defense industry Thursday (Stage A)
10.00
The space industry as a catalyst for global competitiveness
10.30
ESA: What we do and how the Hungarian industry works with us
11.00
PCIe based MMU development
11.30
Snooping water on the Moon
12.00
The Earth Observation vision of 4iG Space and Defence Technologies
12.30
Investigation of counter UAV solutions
13.00
Hungary in Space - the HUNOR Programme
13.30
Development of a reference signal source for the EnVision space probe
New challenges, technological responses Thursday (Stage B)
10.00
Beyond electronics, or modern technologies for single-cell level studies - modified atomic force microscopy, the potential of FluidFM
10.30
Developing sustainable electronics substrates - challenges and solutions through the eyes of a technologist
11.00
Moisture and humidity: the primary challenge for sustainable printed circuit board substrates?
11.30
Sustainable electronic substrates - application and prototyping through the eyes of a circuit designer
Closing Ceremony Thursday (Stage A)
14.35
MELT Student Soldering Competition announcement of results
14.45
IPC Hand Soldering Competition announcement of results
14.55
Closing remarks

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