Program

		Péter Szabó Cleaning before coating - the latest insights
		Béla Bődi Everybody does it differently, or a few words about thermocouple attachment methods!
		Sruti Balasubramanian Actnano coatings for protecting high reliability electronics
		András Pruszák Resilience and possibilities in the electronic manufacturing – Panasonic’s Autonomous Factory
		András Kozma The application of vacuum technology in the reflow soldering process.
		Cristian Tudor Electrification & Power Modules – Innovative High Reliability Solder Materials
		György Szegedi IoT 2025: Connected Intelligence - Opportunities, Challanges, and What's Behind It
		Miklós Kállai Which is better? Sealed or Open X-Ray source: Performance, Maintenance and Application fields
		Andreas Heltmann Sustainable reflow technology: Optimization for the SMD production
		Tibor Szarka The Impact of Cyber Resilience Act on Products Containing Digital Element
		Csaba Varga How can you revolutionize PCB traceability?
		Martin Kostadinov Solder Inspection Outside to Inside
		Thomas Ginzel The Art of Microdispensing
		Attila Kolinger You can keep up with the accelerating technological evolution!
		Vitor Barros Importance of Vibration and Temperature Monitoring

Opening Ceremony Tuesday (Stage A)
09.05		Dr. Kazi Károly – President of NESH Briefing of the president of the National Electronics Society of Hungary
09.10	InnoElectro Grand Prize ceremony

Closing Ceremony Thursday (Stage A)
14.35		Péter Regős – organizer of the NESH Student Soldering Competition MELT Student Soldering Competition announcement of results
14.45		Philippe Léonard – Senior director, European operations, IPC IPC Hand Soldering Competition announcement of results
14.55		Zsolt Heiling Closing remarks