Gábor Négyesi – Microwave Engineer at BHE Bonn Hungary Electronics Ltd. Development of a reference signal source for the EnVision space probe

Opening Ceremony Tuesday (Stage A)

09.05		Dr. Kazi Károly – President of NESH Briefing of the president of the National Electronics Society of Hungary
09.10	InnoElectro Grand Prize ceremony

Design Tuesday (Stage A)

10.00		Attila Kolinger – Microchip Technologies You can keep up with the accelerating technological evolution!
10.30		György Szegedi – Silicon Laboratories IoT 2025: Connected Intelligence – Opportunities, Challanges, and What's Behind It
11.00		Szabolcs Gigor – Phoenix Contact Ltd Efficiency in wiring
11.15		Szabolcs Gigor – PHOENIX CONTACT Ltd Safe connections for energy storage systems

Artificial Intelligence in Design – Panel discussion Tuesday (Stage A)

11.30

István Nadj – István Nadj–Zsikla Miklós Will engineers be needed in the future? – AI-based technologies in PCB design

Efficiency, reliability, quality control in manufacturing Tuesday (Stage A)

13.00		Csaba Varga – Brady How can you revolutionize PCB traceability?
13.30		Miklós Kállai – Europe Unicomp Technologies Which is better? Sealed or Open X-Ray source: Performance, Maintenance and Application fields
14.00		Péter Gordon Phd – EFI-Labs Technical cleanliness – where are we heading in 2025?
14.30		Tamás Hurtony Phd – EFI-Labs The periodic table in our pocket - the building blocks of electronic products
15.00		Andrea Sarusi-Kiss – KESACON Ltd. PCB strain measurement in focus – innovative wireless technology as extra

Engineering Education – Panel discussion Tuesday (Stage A)

15.30

Dr. László Csaba Ábrahám – Charaf Hassan – Jakab Roland The Future of Engineering Education in Hungary

Innovation in manufacturing I. Tuesday (Stage B)

10.00		Thomas Ginzel – ATT HUNGÁRIA KFT – VERMES TECHNIK GMBH & CO KG Contactless Dispensing – An Alternative for Solder and Sinter Paste Application
10.30		Cristian Tudor – Indium Corporation – E-Tronics Electrification & Power Modules – Innovative High Reliability Solder Materials
11.00		Sruti Balasubramanian – Actnano Inc. – Danutek Actnano coatings for protecting high reliability electronics
11.30		Béla Bődi – Elas Kft. Everybody does it differently, or a few words about thermocouple attachment methods!
12.00		Péter Szabó – Elas Kft. Cleaning before coating - the latest insights

Innovation in manufacturing II. Tuesday (Stage B)

13.30		András Pruszák – Panasonic Factory Solutions Europe – E-Chain Resilience and possibilities in the electronic manufacturing – Panasonic’s Autonomous Factory
14.00		Martin Kostadinov – Saki Europe s.r.o. – Tech Gear Solder Inspection Outside to Inside
14.30		Markus Haas – Herrmann Ultraschalltechnik – Microsolder Kft. The impact of advanced ultrasonic welding on battery integrity and efficiency scaling up battery production
15.00		Vitor Barros – IRaptor Lda / Quiptech Importance of Vibration and Temperature Monitoring
15.30		Sebastian Legierko – Viscom SE Latest Electronics Production – Fully Connected

Industry trends Wednesday (Stage A)

10.00		Tamas Rozsa – Top Tier Consultants (Strategic partner of EY-Parthenon) Quantifying Change: Navigating the 2025 Automotive Industry Bottom and the Road Ahead in Europe
10.30		Ferenc Illés – Regional Sales Manager, Arrow Electronics Electronic components market overview
11.00		Beáta Balázs – Hong Kong Trade Development Council Top Electronics and Innovation Marketplaces in Hong Kong

CyberSecurity Wednesday (Stage A)

11.30		Gergely Bakos – QIMA – CCLab Is Your Product Cyber Resilient?
12.00		Tibor Szarka – Microchip Technology Inc. The Impact of Cyber Resilience Act on Products Containing Digital Element

Innovation in manufacturing III. Wednesday (Stage A)

13.30		Andreas Heltmann – Rehm Thermal Systems GmbH Sustainable reflow technology: Optimization for the SMD production
14.00		András Kozma – Heller Industries – Amtest Group The application of vacuum technology in the reflow soldering process.
14.30		Rui Vidal LX-8 The Brand New, Flexible High Speed Placement Platform

Advanced Electronics Assembly Conference (organized by SMTA) Wednesday (Stage B)

10.00		Tobias Herrmann – ZESTRON Corporation Strategies for Cost Optimized Realization of Technical Cleanliness Requirements in Electronics Manufacturing
11.00		Dr Lore Grohmann – Teknek Why Clean Bare Boards? Exploring Contact Cleaning for Effective Contamination Control at the Start of the SMT Line
12.00		Marcin Mierzejewski – Kerafol Keramische Folien GmBH Thermally Conductive Granulates as Advanced Materials for Electronic Protection
14.00		Adalbert Balogh – Plexus Corp. Advanced Conformal Coating Processes
15.00		John Watson – SMTA Beyond FR4: Exploring Advanced and Organic Materials in PCB Design

Space and defense industry Thursday (Stage A)

11.00		Péter Németh – PCD Design Kft. PCIe based MMU development
11.30		Mátyás Hazadi – Puli Space Technologies Snooping water on the Moon
12.00		András Sik PhD – Chief Geodata Officer, 4iG Space and Defence Technologies The Earth Observation vision of 4iG Space and Defence Technologies
12.30		Zoltán Nyemcsok – 4iG Space and Defence Technologies Investigation of counter UAV solutions
13.00		László Benkucs – Space and development policy expert, Ministry of Foreign Affairs and Trade of Hungary Hungary in Space - the HUNOR Programme

New challenges, technological responses Thursday (Stage B)

10.00		Igor Sallai – Budapest University of Technology and Economics Beyond electronics, or modern technologies for single-cell level studies - modified atomic force microscopy, the potential of FluidFM
10.30		Attila Geczy Phd – BME ETT Developing sustainable electronics substrates - challenges and solutions through the eyes of a technologist
11.00		Csaba Farkas PhD – Budapest University of Technology and Economics, Department of Electronics Technology Moisture and humidity: the primary challenge for sustainable printed circuit board substrates?
11.30		Gergő Havellant – BME-ETT / UNIPCB Ltd. Sustainable electronic substrates - application and prototyping through the eyes of a circuit designer

Closing Ceremony Thursday (Stage A)

14.35		Péter Regős – organizer of the NESH Student Soldering Competition MELT Student Soldering Competition announcement of results
14.45		Philippe Léonard – Senior director, European operations, IPC IPC Hand Soldering Competition announcement of results
14.55		Zsolt Heiling – InnoElectro Closing remarks