Cristian Tudor

Senior Applications Engineer at The Indium Corporation of America

Cristian Tudor provides application engineering support for Indium Corporation’s electronics assembly customers in Central and Eastern Europe. Based in Timisoara, Romania, Cristian has expertise and experience in the selection, use, and application of Indium Corporation’s PCB assembly materials and engineered solders, including solder paste, solder preforms, fluxes, and thermal management materials.

Engineering Dual Alloy Solder Paste Systems to Achieve High Reliability, Energy Savings, Withstand High Junction Temperatures

April 21.

12.30

2026

Helyszín

Stage A

Szekció

Innovation in manufacturing – Soldering

A single solder alloy system like SAC305 has multiple elements (Sn, Ag & Cu) in one alloy where the composition of every solder particle in the paste is SAC305. Mechanical properties of single alloy systems typically can only go one direction – more ductile / less ductile; more brittle / less...