This presentation will be in Hungarian!
Thermal measurement of electronic assemblies (profiling) is essential when setting up a reflow process. Accurate measurements must be made to ensure assemblies are processed within the prescribed specifications, as dictated by component and solder paste manufacturers.
Using a reliable, accurate thermal profiler is prerequisite as are the software tools to analyze the measured results. There are, however, other factors that must be considered. How and where thermocouples are attached to the workpiece are major factors and should not be overlooked. How they are attached, is far influence the accuracy and repeatability of the measured values. To better understand these influences, a study was undertaken by Electronic Controls Design Inc. (ECD) to measure and compare the various thermocouple attachment methods commonly used in the electronics industry. This presentation will reveal the results of that study.
