Contactless Dispensing – An Alternative for Solder and Sinter Paste Application
|
08 April
2025
|
Stage B
|
Solder paste is widely used in SMT and electronics production, while sinter pastes with silver, copper, or other conductive metals are increasingly important in semiconductor packaging.
Traditional methods like stencil printing or needle dispensing often face limitations in flexibility, precision, and material handling.
This talk presents contactless jet dispensing as a flexible, precise, and material-efficient alternative for applying solder and sinter pastes, helping engineers tackle key process challenges in electronics manufacturing.
