SMTA

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Electronic assemblies are being used in more harsh environments than ever before, leading to intermittent faults and warranty claims.

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This presentation focuses on the critical role of the Objective Evidence in maintaining robust process control, specifically on Surface Insulation Resistance (SIR) and electrochemical migration as required by the latest IPC J-STD001 standards.

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This presentation will high light the benefits and show the process used in both contact and laser soldering to exceed the requirements of IPC 610 criteria.

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This presentation provides deep insights into the process of condensate formation in the soldering process.

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The BTC (Bottom Terminated Components) such as the Quad flat no-lead (QFN) leadless package is a miniaturized complex component that is low cost and offers heat dissipation through the thermal lug.

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The use of Sn-Bi low temperature solders (LTS) is increasing in the consumer computer market segment. This talk will define low temperature solders’ classification, describe their drivers for use, benefits and drawbacks.

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Processing solder paste using Type 6 and finer powders requires a thorough examination of current materials, equipment, and processes to ensure success.

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The transition to "lead-free" soldering prompted the widespread use of SnAgCu (SAC) solder alloys, notably low Ag content variants such as SAC0307 and SAC105 due to their cost-effectiveness and thermomechanical properties. Enhancing these alloys, nano-sized ceramic...